The Back-End R&D Support Team provides baseline processing services in the areas of laser treatments (local ablation of dielectrics, junction edge isolation) and screen-printed metallisation. Both multicrystalline and monocrystalline silicon wafers are processed with state-of-the-art equipment featuring industrial wafer throughput rates.
For further information, please contact:
Dr Vinodh SHANMUGAM
Head, Back-End R&D Support Team